Product Id Chemical Purity Form Size Description Stock
SPNBTI1D6T3N5
   
NbTi 99.95% Sputtering Target 1 inch dia x 0.250 inch th. 50/50 at% POR 1 pcs
TPITO10D10T5N
   
ITO 99.999% Pellets 10 mm dia X 10 mm th. 95/5 wt% POR 1.5 kg
SPHFB23D3T2N5
   
HfB2 99.5 % Sputtering Target 3 inch dia x 0.125 inch th. HP POR 2 pcs
POCS2WO41403N
   
Cs2WO4 99.9% Powder - 140 + 325 mesh POR 8 kg
PORU3250003N5
   
Ru 99.95 % Powder - 325 mesh approx High purity grade POR 7.500 kg
GRBE3600002N0
   
Be 99.0% Granules 3 mm - 6 mm VIM

DOT restricted
Export license may be required for certain destinations

POR 500 g
POCSWO310003N
   
CsWO3 99.9% Powder - 100 mesh POR CO
TPW3D3T0003N5
   
W 99.95% Pellets 3 mm dia X 3 mm th. Sintered POR 1 kg
FOCR5410003N5
   
Cr 99.95% Foil 54 mm dia x 1 mm POR 2 pcs
POAG00000002N
   
Ag 99% Powder 20 - 50 micron Spherical POR 1.5 kg
SPIGZO3D6T04N
   
IGZO 99.99 % Sputtering Target 3 inch dia x 0.25 inch th. 1:1:1 mol%, RD~95%, HD, Gray

HIP
microelectronics grade

POR 2 pcs
BSEB6700000N0
   
Elastomer bonding 0% Bonding Service 6 mm - 7.99 mm dia. Bonding Service

Customer supplies backing plate

POR Stock
BSAGEB78000N0
   
Silver Epoxy Bonding 0% Bonding Service 7 inch - 8.99 inch dia. Silver Epoxy Bonding

Bonding service, customer supplies backing plate.

POR Stock
BSAGEB56000N0
   
Silver Epoxy Bonding 0% Bonding Service 5 inch - 6.99 inch dia. Silver Epoxy Bonding

Bonding service, customer supplies backing plate.

POR Stock
BSAGEB34000N0
   
Silver Epoxy Bonding 0% Bonding Service 3 inch - 4.99 inch dia. Silver Epoxy Bonding

Bonding service, customer supplies backing plate.

POR Stock
BSAGEB12000N0
   
Silver Epoxy Bonding 0% Bonding Service 1 inch - 2.99 inch dia. Silver Epoxy Bonding

Bonding service, customer supplies backing plate.

POR Stock
SPIGZO3D3T04N
   
IGZO 99.99 % Sputtering Target 3 inch dia x 0.125 inch th. 1:1:1 mol%, HD, Gray, HIP

RD~90-95%, microelectronics grade

POR 2 pcs
POCOCL21002N7
   
CoCl2 99.7 % Powder - 100 mesh approx 2 wt% H2O, DS

Bulk packing
Allow 4 wks to ampule

POR 10.00 kg
POSRI2100004N
   
SrI2 99.99 % Powder - 100 mesh approx Anhydrous

Allow 2/4 weeks for ampulation.

POR CO
POTISI24002N5
   
TiSi2 99.5 % Powder - 400 mesh (7.53 mic aps) POR 15 kg
POTISI22002N5
   
TiSi2 99.5 % Powder - 200 mesh (10 mic aps) POR 12 kg
BEINCL310005N
   
InCl3 99.999 % Beads - 100 mesh DS, Ultra Dry POR 100 kg
PORBF1000003N
   
RbF 99.9% Powder - 100 mesh POR 500 g
POSMS2000003N
   
SmS 99.9% Powder - 200 mesh VIM POR CO
POSMS2000003N
   
SmS 99.9% Pieces 3 - 6 mm VIM POR CO
GRSM2S336003N
   
Sm2S3 99.9 % Granules 3 mm - 6 mm POR CO
SPHFC1D6T02N5
   
HfC 99.5 % Sputtering Target 1 inch dia x 0.25 inch th. HP POR CO
SPHFC4D6T02N5
   
HfC 99.5 % Sputtering Target 4 inch dia x 0.25 inch th. HP POR CO
POYB20000003N
   
Yb 99.9% Powder - 200 mesh

Flammable
Produced under Hydrogen
Packed under argon

POR 2 kg
SHIN1300004N5
   
In 99.995% Shots 1 - 3 mm vac. melted POR 2.00 kg
SPTIAL7D0T2N7
   
TiAl 99.7% Sputtering Target 7.521 inch dia x 0.563 inch th. 50:50 at%, vac. melted

MRC plate

POR 7 pcs
POMN20000004N
   
Mn 99.99% Powder - 20 mesh Spray Grade POR 22.00 kg
POMN3250003N5
   
Mn 99.95 % Powder - 325 mesh (10.40 mic aps) approx Mn, Electrolytic POR 20.00 kg
SPCOGA3D3T04N
   
CoGa 99.99% Sputtering Target 3 inch dia x 0.125 inch th. (50/50 at%) Co:Ga, VIM-HP POR CO
SPCOGA2D3T04N
   
CoGa 99.99% Sputtering Target 2 inch dia x 0.125 inch th. (50/50 at%) Co:Ga, VIM-HP POR CO
SPMNGA3D3T03N
   
MnGa 99.9% Sputtering Target 3 inch dia x 0.125 inch th. (50/50 at%) Mn:Ga, VIM-HP POR CO
SPMNGA2D3T03N
   
MnGa 99.9% Sputtering Target 2 inch dia x 0.125 inch th. (50/50 at%) Mn:Ga, VIM-HP POR CO
WASIC110002N5
   
SiC 99.5% Wafer 1 inch x 1 inch x 0.35 mm th. 4H-SiC, N-Type POR 1 pcs
SPAL2O314D6T5N
   
Al2O3 99.999 % Sputtering Target 14 inch dia x 0.25 inch th. HP

RD~80%
Fully oxidized, microelectronics grade

POR 2 pcs
POTEO232503N5
   
TeO2 99.95% Powder - 325 mesh (12.5 mic aps) approx White POR 7 kg