Product Id Chemical Purity Form Size Description Stock
SPIGZO1D6T04N-2
   
IGZO 99.99 % Sputtering Target 1 inch dia x 0.250 inch th. 1:1:1 mol% In2O3:Ga2O3:ZnO

Green
HP
RD~95%, microelectronics grade

POR 1 pcs
SPIGZO3D3T04N-6
   
IGZO 99.99 % Sputtering Target 3 inch dia x 0.125 inch th. 1:1:1 mol%, Greenish, HP

High Density, >95%, microelectronics grade

POR 5 pcs
SPIGZO1D6T04N-1
   
IGZO 99.99 % Sputtering Target 1 inch dia x 6 mm th. 1:1:1 mol% In2O3:Ga2O3:ZnO

Yellow
HP
RD~65-75%, microelectronics grade

POR 1 pcs
POCR2B10002N5-1
   
Cr2B 99.5 % Powder - 100 mesh (23 mic aps) approx mixed phases present POR 3.00 kg
POSRCO332504N-1
   
SrCO3 99.99% Powder - 325 mesh (15 mic aps) approx

D10=5.65, D50=19.04 MIC, D95=67.53

POR 40.00 kg
SPIGZO2D6T04N-4
   
IGZO 99.99 % Sputtering Target 2 inch dia x 0.25 inch th. 1:1:1 mol%

High Density, yellow
HP
RD~80%, microelectronics grade

POR 2 pcs
SPMO51410063N5
   
Mo 99.95 % Sputtering Target 514 mm x 100 mm x 6.5 mm th. RD~99% POR 1 pcs
GRSR6000002N8
   
Sr 99.8 % Granules 6.00 mm solids, packed in oil

Dendric form

POR 1 kg
PONICRFENBMOCO1
   
NiCrFeNbMoCo 99.9% Powder - 100 mesh approx 55/18/18/5/3/1 wt% Ni:Cr:Fe:Nb:Mo:Co

Allow 4 weeks for production

POR 2 kg
PONICRFENBMOCO3
   
NiCrFeNbMoCo 99.9% Powder - 325 mesh approx 55/18/18/5/3/1 wt% Ni:Cr:Fe:Nb:Mo:Co

Allow 4 weeks for production

POR 2 kg
POCR2N20002N5
   
Cr2N 99.5 % Powder - 200 mesh approx

Mixed phases (Cr2N+ CrN) may be present

POR 5 kg