Product Id Chemical Purity Form Size Description Stock
POLINIPO41002N
   
LiNiPO4 99% Powder - 100 mesh POR QUOTE
POLICOPO41002N5
   
LiCoPO4 99.5% Powder - 100 mesh POR QUOTE
WASI45000005N-1
   
Si 99.999% Wafer 4 inch dia x 5.25 mm th. Antimony (Sb) doped, N type POR QUOTE
WASI45000005N
   
Si 99.999% Wafer 4 inch dia x 5.25 mm th. B (Boron) doped, P type POR QUOTE
WASI66000005N-1
   
Si 99.999% Wafer 6 inch dia x 6.25 mm th. Sb (Antimony) doped, N type POR QUOTE
WASI66000005N
   
Si 99.999% Wafer 6 inch dia x 6.25 mm th. B (Boron) doped, P type POR QUOTE
INMGO230115753N
   
MgO 99.9% Ingot 230 x 115 x 75 mm POR QUOTE
POYSZ457202N8
   
YSZ 99.8% Powder 45 - 72 micron 52/48 mol% ZrO2:Y2O3 (HfO2<1.10mol%)

vac. melted

POR QUOTE
CQSRTIO3101003N
   
SrTiO3 99.9% Cubes/Squares 10 mm w. x 10 mm h. x 0.5 mm d. x

Single crystal substrate (100 orientation), Single side polished.

POR QUOTE
POTIH220002N7
   
TiH2 99.7% Powder - 200 mesh POR 500 g
POTB2O33253N5
   
Tb2O3 99.95% Powder - 325 mesh POR QUOTE
SPNIFE2D3T3N5-5
   
NiFe 99.95% Sputtering Target 2 inch dia x 0.125 inch th. 81/19 wt% Ni:Fe, VIM POR QUOTE
SPCOFE2D3T04N-3
   
CoFe 99.99% Sputtering Target 2 inch dia x 0.125 inch th. 10/90 wt% Co:Fe, VIM POR Stock
SPCOFE2D3T04N-2
   
CoFe 99.99% Sputtering Target 2 inch dia x 0.125 inch th. 30/70 wt% Co:Fe, VIM POR Stock
SPCOFE2D3T04N-1
   
CoFe 99.99% Sputtering Target 2 inch dia x 0.125 inch th. 70/30 wt% Co:Fe, VIM POR Stock
SPCOFE2D3T04N
   
CoFe 99.99% Sputtering Target 2 inch dia x 0.125 inch th. 90/10 wt% Co:Fe, VIM POR Stock
POZNO1000005N
   
ZnO 99.999% Powder - 100 mesh high purity POR QUOTE
GRRBI0100004N
   
RbI 99.99% Granules - 10 mesh DS POR QUOTE
SPPBOCS4D3T3N
   
PbO/Cs 99.9% Sputtering Target 4 inch dia x 0.125 inch th. HP POR QUOTE
TPTIO28D5T04N
   
TiO2 99.99 % Pellets 8 mm dia X 5 mm th. vac. sintered

outgassed, black

POR 800 g
SPRU3D3T003N5-1
   
Ru 99.95% Sputtering Target 3 inch dia x 0.125 inch th. POR 1 pcs
SPCUGAO3D6T3N
   
Cu2O-Ga2O3 99.99% Sputtering Target 3 inch dia x 0.25 inch th. 1:1 mol Cu2O:Ga2O3, HP POR 1 pcs
POYBC3756254N5
   
YBC-375 99.995% Powder - 625 mesh DFM POR QUOTE
SPTAN317002N5
   
TaN 99.5% Sputtering Target 3 inch x 17 inch x 0.25 inch th. HP POR QUOTE
SPCUGAO3D3T3N
   
Cu2O-Ga2O3 99.9% Sputtering Target 3 inch dia x 0.125 inch th. 1:1 mol Cu2O:Ga2O3, HP POR CO
SPTAN3170003N
   
TaN 99.9% Sputtering Target 3 inch x 17 inch x 0.25 inch th. HP POR QUOTE
GRKF3600003N5
   
KF 99.95% Granules 3 mm - 6 mm Hygroscopic POR QUOTE
WRPT05000004N
   
Pt 99.99% Wire 0.033 mm dia. x 50 meter length VIM POR QUOTE
POCR1613003N5
   
Cr 99.95% Powder d10: 1 d50: 6.694 d90: 13.72 micron POR Stock
GPRH1400003N5
   
Rh 99.95% Pieces 1 - 4 mm Sintered POR QUOTE
SPSB2D0T0005N
   
Sb 99.999% Sputtering Target 2 inch dia x 0.06 mm th. HP/EDM cut surface POR CO
GPC360000-1N0
   
C % Pieces 3 - 6 mm Ash <0.03%

Expanded graphite (3-4 kg/m^3)

POR QUOTE
GPTE13000007N
   
Te 99.99999% Pieces 1 - 3 mm VIM POR QUOTE
SPTI1D6T004N5
   
Ti 99.995% Sputtering Target 1 inch dia x 0.25 inch th. VIM POR QUOTE
TPCZTS3D3T3N5
   
CZTS 99.95% Granules 3 mm - 6 mm VIM melted POR 100 g
SPGAN1D6T005N
   
GaN 99.999% Sputtering Target 1 inch dia x 0.25 inch th. HP POR QUOTE
POTAC102502N5
   
TaC >99.5% Powder 10 - 25 micron POR QUOTE
POCOCR2O430742N
   
CoCr2O4 99% Powder 30 - 74 micron POR QUOTE
PONIFE2O430742N
   
NiFe2O4 99% Powder 30 - 74 micron POR QUOTE
PONICR2O430742N
   
NiCr2O4 99% Powder 30 - 74 micron POR QUOTE