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  • Au2O3

  • Formula: Au2O3
  • CAS: 1303-58-8
  • Gold Oxide
  • (1) ▾
Product Id Purity Form Size Description Stock
PAU2O3500004N
   
99.99 % Powder - 50 mesh >88.5 % Gold CO
  • AuBe

  • Formula: AuBe
  • CAS: 12044-69-8
  • Gold Beryllium
  • (2) ▾
Product Id Purity Form Size Description Stock
GAUBE360003N
   
99.9% Pieces 3-6 mm 99:1 wt% CO
GAUBE360003N
   
99.9% Pieces 3-6 mm 50:50 wt% CO
  • BaKBiO3

  • Formula: BaKBiO3
  • CAS:
  • Barium Potassium Bismuth Oxide
  • (1) ▾
Product Id Purity Form Size Description Stock
SBAKBIO1D3T3N
   
99.9 % Sputtering target 1 inch dia x 0.125 inch th. HP CO
  • BaTiO3

  • Formula: BaTiO3
  • CAS: 12047-27-7
  • Barium Titanate (Barium Titanium Oxide)
  • (19) ▾
Product Id Purity Form Size Description Stock
GBATIO314003N
   
99.9 % Pieces 1-4 mm vac. sintered BO
GBATIO33123N5
   
99.95 % Pieces 3-12 mm vac. sintered 10 kg
PBATIO312503N
   
99.95 % Powder -1250 mesh (3.5 mic aps) 37 kg
PBATIO33253N5
   
99.95 % Powder -325 mesh (5.19 mic aps) 30 kg
RBATIOXDYT3N5
   
99.95 % Rod 25.4 mm dia x 50.8 mm th. 5 pcs
RBATIOXTYD3N5
   
99.95 % Rod 25.4 mm dia x 25.4 mm th. 7 pcs
SBATIO2D6T3N5
   
99.95 % Sputtering target 2 inch dia x 0.25 inch th. HP 2 pcs
SBATIO31D3T3N
   
99.9 % Sputtering target 1 inch dia x 0.125 inch th. HP, PSD <2 mic 1 pc
SBATIO31D6T3N
   
99.9 % Sputtering target 1 inch dia x 0.25 inch th. HP BO
SBATIO32D3T3N
   
99.95 % Sputtering target 2 inch dia x 0.125 inch th. HP 3 pcs
SBATIO34D3T3N
   
99.95 % Sputtering target 4 inch dia x 0.125 inch th. HP BO
SBATIO36D3T3N
   
99.95 % Sputtering target 6 inch dia x 0.125 inch th. HP BO
SBATIO36D6T6N5
   
99.95 % Sputtering target 6 inch dia x 0.25 inch th. HP BO
SBATIO38D3T3N
   
99.95 % Sputtering target 8 inch dia x 0.125 inch th. HP BO
SBATIO38D6T3N
   
99.95 % Sputtering target 8 inch dia x 0.25 inch th. HP CO
SBATIO3D3T3N5
   
99.95 % Sputtering target 3 inch dia x 0.125 inch th. HP 3 pcs
SBATIO3D6T3N5
   
99.95 % Sputtering target 3 inch dia x 0.25 inch th. HP 3 pcs
SBATIO3MRC3N5
   
99.95 % Sputtering target 4.75 inch x 14.875 inch x 0.25 inch HP, PSD <0.2 mic 1 pc
SBATIO4D6T03N
   
99.9 % Sputtering target 4 inch dia x 0.25 inch th. HP 1 pc
  • BiFeO3

  • Formula: BiFeO3
  • CAS:
  • Bismuth Ferrite
  • (9) ▾
Product Id Purity Form Size Description Stock
SBIFEO31D3T4N
   
99.99 % Sputtering target 1 inch dia x 0.125 inch th. HP 2 pcs
SBIFEO31D6T4N
   
99.99 % Sputtering target 1 inch dia x 0.25 inch th. HP BO
SBIFEO32D3T4N
   
99.99 % Sputtering target 2 inch dia x 0.125 inch th. HP 2 pcs
SBIFEO32D6T4N
   
99.99 % Sputtering target 2 inch dia x 0.25 inch th. HP 1 pc
SBIFEO33D3T4N
   
99.99 % Sputtering target 3 inch dia x 0.125 inch th. HP 2 pcs
SBIFEO33D6T4N
   
99.99 % Sputtering target 3 inch dia x 0.25 inch th. HP 2 pcs
SBIFEO34D3T4N
   
99.99 % Sputtering target 4 inch dia x 0.125 inch th. HP 1 pc
SBIFEO34D6T4N
   
99.99 % Sputtering target 4 inch dia x 0.25 inch th. HP 1 pc
SBIFEO36D6T4N
   
99.99 % Sputtering target 6 inch dia x 0.25 inch th. HP CO
  • BSCCO

  • Formula: Bi2Sr2Ca(x-1)CuxO(2x+4)
  • CAS: 114901-61-0
  • Bismuth Strontium Calcium Copper Oxide
  • (4) ▾
Product Id Purity Form Size Description Stock
SBSCCO1D3TA3N
   
99.9 % Sputtering Target 1 inch dia x 0.125 inch th. 2:2:2:3:10, HP 1 pc
SBSCCO1D3TB3N
   
99.9 % Sputtering target 1 inch dia x 0.125 inch th. 2:2:1:2:8, HP 1 pc
SBSCCO2D3TA3N
   
99.9 % Sputtering target 2 inch dia x 0.125 inch th. 2:2:2:3:10, HP CO
SBSCCO2D3TB3N
   
99.9 % Sputtering target 2 inch dia x 0.125 inch th. 2:2:1:2:8, HP CO
  • CaMnO3

  • Formula: CaMnO3
  • CAS:
  • Calcium Manganite (Calcium Manganese Oxide)
  • (1) ▾
Product Id Purity Form Size Description Stock
SCAMNO32D3T3N
   
99.95 % Sputtering target 2 inch dia x 0.125 inch th. HP, best effort basis CO
  • CoSiB

  • Formula: CoSiB (68/17/15 at%)
  • CAS:
  • Cobalt Silicon Boron
  • (2) ▾
Product Id Purity Form Size Description Stock
SCOSIB2D3T03N
   
99.95% Sputtering target 2 inch dia x 0.125 in th. HP CO
SCOSIB3D3T03N
   
99.95% Sputtering target 3 inch dia x 0.125 in th. HP CO
  • FTO

  • Formula: SnO2-SnF2
  • CAS:
  • Fluorine-doped Tin Oxide
  • (11) ▾
Product Id Purity Form Size Description Stock
GFTO36000004N
   
99.99 % Granules 3-6 mm 80:20 wt%, Press. sintered 200 g
GFTO36000004N
   
99.99 % Granules 3-6 mm 70:30 wt%, Press. sintered 200 g
PFTO10000005N
   
99.999 % Powder -100 mesh 90:10 wt%, ultra high purity 500 g
PFTO42500005N
   
99.999 % Powder -425 mesh (-10 mic) 90:10 wt%, ultra high purity 500 g
SFTO1D3T0004N
   
99.99 % Sputtering target 1 inch dia x 0.125 inch th. 90:10 wt%, SnO2-F doped CO
SFTO1D6T0004N
   
99.99 % Sputtering target 1 inch dia x 0.25 inch th. 90:10 wt%, SnO2-F doped CO
SFTO2D3T0004N
   
99.99 % Sputtering target 2 inch dia x 0.125 inch th. 90:10 wt%, SnO2-F doped 2 pcs
SFTO2D6T0004N
   
99.99 % Sputtering target 2 inch dia x 0.25 inch th. 90:10 wt%, SnO2-F doped 2 pcs
SFTO3D3T0004N
   
99.99 % Sputtering target 3 inch dia x 0.125 inch th. 90:10 wt%, SnO2-F doped 2 pcs
SFTO3D6T0004N
   
99.99 % Sputtering target 3 inch dia x 0.25 inch th. 90:10 wt%, SnO2-F doped CO
SFTO4D6T0004N
   
99.99 % Sputtering target 4 inch dia x 0.25 inch th. 90:10 wt%, SnO2-F doped 2 pcs (Blanks)