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  • Au2O3

  • Formula: Au2O3
  • CAS: 1303-58-8
  • Gold Oxide
  • (1) ▾
Product Id Purity Form Size Description Stock
POAU2O350004N
   
99.99 % Powder - 50 mesh >88.5 % Gold CO
Product Id Purity Form Size Description Stock
GPAUBE360003N-1
   
99.9 % Pieces 3 - 6 mm 50:50 wt% CO
GPAUBE360003N
   
99.9 % Pieces 3 - 6 mm 99:1 wt% CO
Product Id Purity Form Size Description Stock
SPBAKBIO1D3T3N
   
99.9 % Sputtering Target 1 inch dia x 0.125 inch th. HP CO
Product Id Purity Form Size Description Stock
GPBATIO31403N
   
99.9 % Pieces 1 - 4 mm vac. sintered BO kg
GPBATIO33123N5
   
99.95 % Pieces 3 - 12 mm vac. sintered 10 kg
POBATIO312503N5
   
99.95 % Powder - 1250 mesh (3.5 mic aps) 37 kg
POBATIO33253N5
   
99.95 % Powder - 325 mesh (5.19 mic aps) 30 kg
ROBATIO325D50T3N5
   
99.95 % Rod 25.4 mm dia x 50.8 mm length 5 pcs
ROBATIO325D25T3N5
   
99.95 % Rod 25.4 mm dia x 25.4 mm length Sintered 7 pcs
SPBATIO32D6T3N5
   
99.95 % Sputtering Target 2 inch dia x 0.25 inch th. HP 2 pcs
SPBATIO31D3T3N
   
99.9 % Sputtering Target 1 inch dia x 0.125 inch th. HP, PSD <2 mic 1 pcs
SPBATIO31D6T3N
   
99.9 % Sputtering Target 1 inch dia x 0.25 inch th. HP BO
SPBATIO32D3T3N5
   
99.95 % Sputtering Target 2 inch dia x 0.125 inch th. HP 3 pcs
SPBATIO34D3T3N5
   
99.95 % Sputtering Target 4 inch dia x 0.125 inch th. HP BO
SPBATIO36D3T3N5
   
99.95 % Sputtering Target 6 inch dia x 0.125 inch th. HP BO
SPBATIO36D6T3N5
   
99.95 % Sputtering Target 6 inch dia x 0.25 inch th. HP BO
SPBATIO38D3T3N5
   
99.95 % Sputtering Target 8 inch dia x 0.125 inch th. HP BO
SPBATIO38D6T3N5
   
99.95 % Sputtering Target 8 inch dia x 0.25 inch th. HP CO
SPBATIO33D3T3N5
   
99.95 % Sputtering Target 3 inch dia x 0.125 inch th. HP 3 pcs
SPBATIO33D6T3N5
   
99.95 % Sputtering Target 3 inch dia x 0.25 inch th. HP 3 pcs
SPBATIO3MRC3N5
   
99.95 % Sputtering Target MRC (4.75 inch x 14.875 inch x 0.250 inch th.) HP, PSD <0.2 mic 1 pcs
SPBATIO34D6T3N
   
99.9 % Sputtering Target 4 inch dia x 0.25 inch th. HP 1 pcs
Product Id Purity Form Size Description Stock
SPBIFEO31D3T4N
   
99.99 % Sputtering Target 1 inch dia x 0.125 inch th. HP 2 pcs
SPBIFEO31D6T4N
   
99.99 % Sputtering Target 1 inch dia x 0.25 inch th. HP CO
SPBIFEO32D3T4N
   
99.99 % Sputtering Target 2 inch dia x 0.125 inch th. HP 2 pcs
SPBIFEO32D6T4N
   
99.99 % Sputtering Target 2 inch dia x 0.25 inch th. HP 2 pcs
SPBIFEO33D3T4N
   
99.99 % Sputtering Target 3 inch dia x 0.125 inch th. HP 2 pcs
SPBIFEO33D6T4N
   
99.99 % Sputtering Target 3 inch dia x 0.25 inch th. HP 2 pcs
SPBIFEO34D3T4N
   
99.99 % Sputtering Target 4 inch dia x 0.125 inch th. HP 1 pcs
SPBIFEO34D6T4N
   
99.99 % Sputtering Target 4 inch dia x 0.25 inch th. HP 1 pcs
SPBIFEO36D6T4N
   
99.99 % Sputtering Target 6 inch dia x 0.25 inch th. HP CO
  • BSCCO

  • Formula: Bi2Sr2Ca(x-1)CuxO(2x+4)
  • CAS: 114901-61-0
  • Bismuth Strontium Calcium Copper Oxide
  • (4) ▾
Product Id Purity Form Size Description Stock
SBSCCO1D3TA3N
   
99.9 % Sputtering Target 1 inch dia x 0.125 inch th. 2:2:2:3:10, HP 1 pc
SBSCCO1D3TB3N
   
99.9 % Sputtering target 1 inch dia x 0.125 inch th. 2:2:1:2:8, HP 1 pc
SBSCCO2D3TA3N
   
99.9 % Sputtering target 2 inch dia x 0.125 inch th. 2:2:2:3:10, HP CO
SBSCCO2D3TB3N
   
99.9 % Sputtering target 2 inch dia x 0.125 inch th. 2:2:1:2:8, HP CO
Product Id Purity Form Size Description Stock
SPCAMNO32D3T3N5
   
99.95 % Sputtering Target 2 mm dia x 0.125 inch th. HP, best effort basis CO
  • CoSiB

  • Formula: CoSiB
  • CAS:
  • Cobalt Silicon Boron
  • (2) ▾
Product Id Purity Form Size Description Stock
SPCOSIB2D3T3N5
   
99.95% Sputtering Target 2 inch dia x 0.125 inch th. HP CO
SPCOSIB3D3T3N5
   
99.95% Sputtering Target 3 inch dia x 0.125 inch th. HP CO
Product Id Purity Form Size Description Stock
GRFTO3600004N
   
99.99 % Granules 3 mm - 6 mm 80:20 wt%, Press. sintered

Moisture sensitive

200 g
GRFTO3120004N
   
99.99 % Granules 3 mm - 12 mm 70:30 wt%, Press. sintered 200 g
POFTO1000003N
   
99.9 % Powder - 100 mesh 90:10 wt%, Moisture sensitive 500 g
POFTO4250004N
   
99.99 % Powder - 425 mesh 90:10 wt%, Moisture sensitive 500 g
SPFTO1D3T004N
   
99.99 % Sputtering Target 1 inch dia x 0.125 inch th. 90:10 wt%, SnO2-F doped CO
SPFTO1D6T004N
   
99.99 % Sputtering Target 1 inch dia x 0.25 inch th. 90:10 wt%, SnO2-F doped CO