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Product Id Purity Form Size Description Stock
GRALF3140004N
   
99.99 % Granules 1 mm - 4 mm For DUV coating @ 193 nm 1 kg
GRALF336002N5
   
99.5 % Granules 3 mm - 6 mm vac. sintered

Ultra high purity
For DUV coating @ 193 nm

1.00 kg
POALF3100003N
   
99.9 % Powder - 100 mesh Synthetic powder 400 kg
POALF3100004N
   
99.99 % Powder - 100 mesh Synthetic powder 1.00 kg
Product Id Purity Form Size Description Stock
GRERF3140004N
   
99.99 % Granules 1 mm - 4 mm Sintered 1 kg
POERF332504N5
   
99.995 % Powder - 325 mesh DFM, vac. melted 5.60 kg
GPERF331204N5
   
99.995 % Pieces 3 - 12 mm 2.800 kg
POERF350003N5
   
99.95 % Powder - 500 nm (.720 mic aps) approx Nano particles, precipitated CO
SPERF32D3T04N
   
99.99 % Sputtering Target 2 inch dia x 0.125 inch th. CO
Product Id Purity Form Size Description Stock
GRGDF314004N5
   
99.995 % Granules 1 mm - 4 mm vac. sintered, vac. sintered 6.00 kg
GPGDF336004N5
   
99.995 % Pieces 3 - 6 mm DFM, Drip melted

saturated with fluorine
Suitable for 193 nm coating

10 kg
POGDF362504N5
   
99.995 % Powder - 625 mesh (4.5 mic aps) approx vac. melted 15 kg
POGDF3200004N
   
99.99 % Powder - 200 mesh (<74 mic) 79 kg
POGDF332503N8
   
99.98 % Powder - 325 mesh IE, (<40 mic) CO
POGDF340004N5
   
99.995 % Powder - 400 mesh (<5 mic) 1 kg
Product Id Purity Form Size Description Stock
CIHFO213CC3N5
   
99.95 % (Zr<0.5%) Conical Insert 13 cc (Starter source), EB melted 2 pcs
CIHFO215CC3N5
   
99.95 % (Zr<0.5%) Conical Insert 15 cc (Starter source), EB melted 60 pcs
CIHFO215CC4N5
   
99.995 % (Zr<0.3%) Conical Insert 15 cc (Starter source), EB melted 20 pcs
CIHFO225CC3N5
   
99.95 % (Zr<0.5%) Conical Insert 25 cc (Starter source), EB melted 2 pcs
GRHFO2140004N
   
99.99 % (Zr<0.25%) Granules 1 mm - 4 mm white, vac. sintered

low Zr, high purity, high LIDT evaporant, dark gray

13.5 kg
GRHFO214003N5
   
99.95 % (Zr<0.5%) Granules 1 mm - 4 mm white, vac. sintered

low Zr, evaporant for UV apps.

5.00 kg
GRHFO214003N5-1
   
99.95 % (Zr<0.5%) Granules 1 mm - 4 mm black, vac. sintered

Reduced, HfO2 for UV apps.

7.00 kg
GRHFO236004N5
   
99.995 % (Zr<0.17%) Granules 3 mm - 6 mm white, DUV grade

vac. sintered
low Zr, evaporant for DUV apps., white

9.20 kg
POHFO212503N5
   
99.95 % (Zr<0.2%) Powder - 1250 mesh IE 25.00 kg
POHFO2200003N
   
99.9 % (Zr<0.5%) Powder - 200 mesh IE 5.00 kg
POHFO2325004N
   
99.99 % (Zr<0.02%) Powder - 325 mesh Spectrographic grade, IE CO
POHFO232503N5
   
99.95% Powder - 325 mesh (36 mic aps) approx Zr<0.1554 wt%, IE 26.00 kg
POHFO232504N5
   
99.995% Powder 325 mesh approx Zr <0.1650 wt%

Spectrographic grade
IE

CO
ROHFO210D10T4N5
   
99.995 % Rod 10 mm dia x 10 cm length

s, sintered, optically polished
HP

3 pcs
SPHFO21D3T3N5
   
99.95 % Sputtering Target 1 inch dia x 0.125 inch th. HP, RD~80-85% 3 pcs
SPHFO214D6T3N5
   
99.95 % Sputtering Target 14 inch dia x 0.25 inch th. (Zr<0.2%), HP

HD, , RD~80-85%, 4 QTRs construction

CO
SHFO21515104N
   
99.99 % 15 mm x 15 mm x 1 mm

Squares, sintered, optically polished
HP
square probe made via

6 pcs
SPHFO21D3T04N
   
99.99 % (Zr<0.21%) Sputtering Target 1 inch dia x 0.125 inch th. HP, RD~80-85% 2 pcs
SPHFO21D6T04N
   
99.99 % (Zr<0.21%) Sputtering Target 1 inch dia x 0.25 inch th. HP, RD~80-85% 2 pcs
SPHFO22D3T3N5-1
   
99.95 % (Zr<0.3%) Sputtering Target 2 inch dia x 0.125 inch th. (Zr<0.3%), HP, RD~80-85% 2 pcs
SPHFO22D3T3N5
   
99.95 % Sputtering Target 2 inch dia x 0.125 inch th. (Zr<0.5%), HP 4 pcs
SPHFO22D6T3N5-1
   
99.95 % Sputtering Target 2 inch dia x 0.25 inch th. (Zr<0.3%), HP, RD~80-85% 2 pcs
SPHFO22D6T3N5
   
99.95 % Sputtering Target 2 inch dia x 0.25 inch th. (Zr<0.5%), HP, RD~80-85% 1 pcs
SPHFO23D3T3N5-1
   
99.95 % Sputtering Target 3 inch dia x 0.125 inch th. (Zr<0.5%), HP 2 pcs
SPHFO23D3T3N5
   
99.95 % Sputtering Target 3 inch dia x 0.125 inch th. (Zr<0.21%), HP, RD~80-85% 1 pcs
SPHFO23D6T3N5-2
   
99.95 % Sputtering Target 3 inch dia x 0.25 inch th. (Zr<0.3%), HP, RD~80-85% 3 pcs
SPHFO23D6T3N5-1
   
99.95 % Sputtering Target 3 inch dia x 0.25 inch th. (Zr<0.21%), HP, RD~80-85% 2 pcs
SPHFO23D6T3N5
   
99.95 % Sputtering Target 3 inch dia x 0.25 inch th. (Zr<0.5%), HP 2 pcs
SPHFO24D3T3N5-1
   
99.95 % Sputtering Target 4 inch dia x 0.125 inch th. (Zr<0.25%), HP

RD~80-85%, high purity

2 pcs
SPHFO24D3T3N5
   
99.95 % Sputtering Target 4 inch dia x 0.125 inch th. (Zr<0.5%), HP 2 pcs
SPHFO24D6T3N5-1
   
99.95 % Sputtering Target 4 inch dia x 0.25 inch th. (Zr<0.5%), HP 1 pcs