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Product Id Purity Form Size Description Stock
GCDSNO436004N
   
99.99 % Granules 3-6 mm Pressure sintered 0.375 kg
PCDSNO436004N
   
99.99 % Granules -200 mesh Pressure sintered 5.00 kg
SCDSNO42D3T4N
   
99.99 % Sputtering target 2 inch dia x 0.125 inch th. HP BO
SCDSNO42D6T4N
   
99.99 % Sputtering target 2 inch dia x 0.25 inch th. HP BO
SCDSNO43D3T4N
   
99.99 % Sputtering target 3 inch dia x 0.125 inch th. HP BO
SCDSNO44D3T4N
   
99.99 % Sputtering target 4 inch dia x 0.125 inch th. HP 1 pc
SCDSNO44D6T4N
   
99.99 % Sputtering target 4 inch dia x 0.25 inch th. HP BO
SCDSNO46D3T4N
   
99.99 % Sputtering target 3 inch dia x 0.25 inch th. HP BO
SCDSNO46D6T4N
   
99.99 % Sputtering target 6 inch dia x 0.25 inch th. HP BO
SCDSNO48D6T4N
   
99.99 % Sputtering target 8 inch dia x 0.25 inch th. HP BO
Product Id Purity Form Size Description Stock
GCD3AS236004N
   
99.99 % Granules 3-6 mm vac. melted BO
GCD3AS236005N
   
99.999 % Granules 3-6 mm vac. melted, high purity 1.500 kg (in production)
GCD3AS335002N
   
99.0 % Granules 3-50 mm Lump, vac. melted 1.00 kg (in production)
PCD3AS232505N
   
99.999 % Powder -325 mesh vac. melted, high purity 0.400 kg
Product Id Purity Form Size Description Stock
GCDO14000004N
   
99.99 % Granules 1-4 mm 0.500 kg
PCDO32500004N
   
99.99 % Powder -325 mesh 1 kg
PCDO42500005N
   
99.999 % Powder -425 mesh (-10 mic.) ultra high purity BO
SCDO1D3T0004N
   
99.99 % Sputtering target 1 inch dia x 0.125 inch th. HP 1 pc
SCDO2D3T0004N
   
99.99 % Sputtering target 2 inch dia x 0.125 inch th. HP 1 pc
SCDO2D6T0004N
   
99.99 % Sputtering target 2 inch dia x 0.25 inch th. HP 1 pc
SCDO3D3T0004N
   
99.99 % Sputtering target 3 inch dia x 0.125 inch th. HP 1 pc
SCDO3D6T0004N
   
99.99 % Sputtering target 3 inch dia x 0.25 inch th. HP BO
SCDO4D3T0004N
   
99.99 % Sputtering target 4 inch dia x 0.125 inch th. HP 1 pc
SCDO4D6T0004N
   
99.99 % Sputtering target 4 inch dia x 0.25 inch th. HP BO
SCDO6D3T0004N
   
99.99 % Sputtering target 6 inch dia x 0.125 inch th. HP BO
SCDO6D6T0004N
   
99.99 % Sputtering target 6 inch dia x 0.25 inch th. HP BO
SCDO8D6T0004N
   
99.99 % Sputtering target 8 inch dia x 0.25 inch th. HP CO
Product Id Purity Form Size Description Stock
GCDS31200004N
   
99.99 % Granules 3-12 mm vac. sintered 2.00 kg
GCDS31200005N
   
99.999 % Granules 3-12 mm vac. sintered 5 kg
GCDS36000005N
   
99.999 % Granules 3-6 mm vac. melted, and crystallized 5 kg
PCDS32500004N
   
99.99 % Powder -325 mesh (ave.40 mic) Polycrystalline 52 kg
PCDS32500005N
   
99.999 % Powder -325 mesh (17 mic aps) Polycrystalline 8.00 kg
SCDS1D3T0004N
   
99.99 % Sputtering target 1 inch dia x 0.125 inch th. HP, polycrystalline, RD~90% 2 pcs
SCDS1D6T0004N
   
99.99 % Sputtering target 1 inch dia x 0.25 inch th. HP, polycrystalline, RD~90% 1 pc
SCDS2D3T0004N
   
99.99 % Sputtering target 2 inch dia x 0.125 inch th. HP, polycrystalline, RD~90% 2 pcs
SCDS2D3T0005N
   
99.999 % Sputtering target 2 inch dia x 0.125 inch th. HP, Polycrystalline, RD~90% 1 pc
SCDS2D6T0004N
   
99.99 % Sputtering target 2 inch dia x 0.25 inch th. HP, polycrystalline, RD~90% 2 pcs
SCDS2D6T0005N
   
99.999 % Sputtering target 2 inch dia x 0.250 inch th. HP, Polycrystalline, RD~90% 2 pcs
SCDS3D3T0004N
   
99.99 % Sputtering target 3 inch dia x 0.125 inch th. HP, polycrystalline, RD~90% 2 pcs
SCDS3D3T0005N
   
99.999 % Sputtering target 3 inch dia x 0.125 inch th. HP, Polycrystalline, RD~90% 2 pcs
SCDS3D6T0004N
   
99.99 % Sputtering target 3 inch dia x 0.25 inch th. HP, polycrystalline, RD~90% 2 pcs
SCDS3D6T0005N
   
99.999 % Sputtering target 3 inch dia x 0.250 inch th. HP, Polycrystalline, RD~90% 2 pcs
SCDS4D3T0004N
   
99.99 % Sputtering target 4 inch dia x 0.125 inch th. HP, polycrystalline, RD~90% 2 pcs
SCDS4D3T0005N
   
99.999 % Sputtering target 4 inch dia x 0.125 inch th. HP, polycrystalline, RD~90% 1 pc
SCDS4D6T0004N
   
99.99 % Sputtering target 4 inch dia x 0.25 inch th. HP, polycrystalline, RD~90% 3 pcs
SCDS4D6T0005N
   
99.999 % Sputtering target 4 inch dia x 0.250 inch th. HP, Polycrystalline, RD~90% 2 pcs
SCDS6D3T0004N
   
99.99 % Sputtering target 6 inch dia x 0.125 inch th. HP, polycrystalline, RD~90% BO
SCDS6D3T0005N
   
99.999 % Sputtering target 6 inch dia x 0.125 inch th. HP, polycrystalline, RD~90% BO
SCDS6D6T0004N
   
99.99 % Sputtering target 6 inch dia x 0.25 inch th. HP, polycrystalline, RD~90% 2 pcs
SCDS6D6T0005N
   
99.999 % Sputtering target 6 inch dia x 0.250 inch th. HP, polycrystalline, RD~90% BO