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Product Id Purity Form Size Description Stock  
GRCD2SNO4364N
   
99.99 % Granules 3 mm - 6 mm Pressure sintered 0.375 kg
 
POCD2SNO42004N
   
99.99 % Powder - 200 mesh vac. sintered 5.00 kg
 
SPCD2SNO42D3T4N
   
99.99 % Sputtering Target 2 inch dia x 0.125 inch th. HP BO
 
SPCD2SNO42D6T4N
   
99.99 % Sputtering Target 2 inch dia x 0.25 inch th. HP BO
 
SPCD2SNO43D3T4N
   
99.99 % Sputtering Target 3 inch dia x 0.125 inch th. HP BO
 
SPCD2SNO44D3T4N
   
99.99 % Sputtering Target 4 inch dia x 0.125 inch th. HP 1 pcs
 
SPCD2SNO44D6T4N
   
99.99 % Sputtering Target 4 inch dia x 0.25 inch th. HP BO
 
SPCD2SNO43D6T4N
   
99.99 % Sputtering Target 3 inch dia x 0.25 inch th. HP BO
 
SPCD2SNO46D6T4N
   
99.99 % Sputtering Target 6 inch dia x 0.25 inch th. HP BO
 
SPCD2SNO48D6T4N
   
99.99 % Sputtering Target 8 inch dia x 0.25 inch th. HP BO
 
Product Id Purity Form Size Description Stock  
GRCD3AS23604N
   
99.99 % Granules 3 mm - 6 mm vac. melted BO
 
GRCD3AS23605N
   
99.999 % Granules 3 mm - 6 mm vac. melted, high purity CO
 
GRCD3AS23502N
   
99 % Granules 3 mm - 50 mm Lump, vac. melted CO
 
POCD3AS23255N
   
99.999 % Powder - 325 mesh vac. melted, high purity 0.400 kg
 
Product Id Purity Form Size Description Stock  
GRCDO1400004N
   
99.99 % Granules 1 mm - 4 mm 0.500 kg
 
POCDO3250004N
   
99.99 % Powder - 325 mesh 1 kg
 
POCDO4250005N
   
99.999 % Powder - 425 mesh (10 mic aps) ultra high purity BO
 
SPCDO1D3T004N
   
99.99 % Sputtering Target 1 inch dia x 0.125 inch th. HP 1 pcs
 
SPCDO2D3T004N
   
99.99 % Sputtering Target 2 inch dia x 0.125 inch th. HP 1 pcs
 
SPCDO2D6T004N
   
99.99 % Sputtering Target 2 inch dia x 0.25 inch th. HP 1 pcs
 
SPCDO3D3T004N
   
99.99 % Sputtering Target 3 inch dia x 0.125 inch th. HP 1 pcs
 
SPCDO3D6T004N
   
99.99 % Sputtering Target 3 inch dia x 0.25 inch th. HP BO
 
SPCDO4D3T004N
   
99.99 % Sputtering Target 4 inch dia x 0.125 inch th. HP 1 pcs
 
SPCDO4D6T004N
   
99.99 % Sputtering Target 4 inch dia x 0.25 inch th. HP BO
 
SPCDO6D3T004N
   
99.99 % Sputtering Target 6 inch dia x 0.125 inch th. HP BO
 
SPCDO6D6T004N
   
99.99 % Sputtering Target 6 inch dia x 0.25 inch th. HP BO
 
SPCDO8D6T004N
   
99.99 % Sputtering Target 8 inch dia x 0.25 inch th. HP CO
 
Product Id Purity Form Size Description Stock  
GRCDS3120004N
   
99.99 % Granules 3 mm - 12 mm vac. sintered 2.00 kg
 
GRCDS3120005N
   
99.999 % Granules 3 mm - 12 mm vac. sintered 5 kg
 
GRCDS3600005N
   
99.999 % Granules 3 mm - 6 mm vac. melted, and crystallized 5 kg
 
POCDS3250004N
   
99.99 % Powder - 325 mesh (40 mic aps) Polycrystalline 52 kg
 
POCDS3250005N
   
99.999 % Powder - 325 mesh (17 mic aps) Polycrystalline 8.00 kg
 
SPCDS1D3T004N
   
99.99 % Sputtering Target 1 inch dia x 0.125 inch th. HP, polycrystalline, RD~90% 2 pcs
 
SPCDS1D6T004N
   
99.99 % Sputtering Target 1 inch dia x 0.25 inch th. HP, polycrystalline, RD~90% 1 pcs
 
SPCDS2D3T004N
   
99.99 % Sputtering Target 2 inch dia x 0.125 inch th. HP, polycrystalline, RD~90% 2 pcs
 
SPCDS2D3T005N
   
99.999 % Sputtering Target 2 inch dia x 0.125 inch th. HP, Polycrystalline, RD~90% 1 pcs
 
SPCDS2D6T004N
   
99.99 % Sputtering Target 2 inch dia x 0.25 inch th. HP, polycrystalline, RD~90% 2 pcs
 
SPCDS2D6T005N
   
99.999 % Sputtering Target 2 inch dia x 0.25 inch th. HP, Polycrystalline, RD~90% 2 pcs
 
SPCDS3D3T004N
   
99.99 % Sputtering Target 3 inch dia x 0.125 inch th. HP, polycrystalline, RD~90% 2 pcs