We also provide bonding services to adhere the sputtering targets to the backing plates. Indium and Silver-Epoxy bonding agents are chosen provide high electrical and thermal conductivity, channelling heat and charge build-up away from the target. They also protect the target-backing plate interface from diffusion and alleviate stress cause by differing thermal expansion at the interface by thermal creep.
There are different bonding techniques employed by LTS which depends from material to material. Some of these bonding services are listed below:
- Cold Bonding
- Diffusion Bonding
- Explosion Bonding
- Plasma Activated Sinter Bonding