Chemical Name
Bonding service
Chemical Formula
Al + Indium bonding
Purity
99.99%
Composition
Size
11 inch -12.99 inch dia.
EINECS Number
Quantity Available
pcs
CAS Number
Status
Product ID
BSALIB111204N
Hazmat
Catalog Number
5088
Description
Backing plate, bonded to substrate.
Comments
Indium bonding is a critical process used to attach sputtering targets to backing plates, providing high thermal conductivity and mechanical integrity during the deposition process.
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