Bonding service
Bonding ServiceBonding service, Bonding Service, 99.95%, 15 inch -16 inch dia.
Product Specifications
Chemical Name
Chemical Formula
Purity
99.95%
Composition
Size
15 inch -16 inch dia.
EINECS Number
Quantity Available
pcs
CAS Number
Status
Product ID
BSCUCRI15163N5
Hazmat
Catalog Number
5091
Description
Backing plate, bonded to substrate.
Comments
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Element Name
Bonding service
Symbol
CuCr + Indium bonding
Atomic Number
-
Atomic Weight
-
Melting Point
-
Boiling Point
-
Density
-
Crystal Structure
-
Color / Appearance
-
Thermal Conductivity
-
Electrical Resistivity
-
Coefficient of Thermal Expansion
-
Electronegativity
-
Neutron Cross Section
-
Electron Configuration
-
This Product
BSCUCRI15163N5
Form
Bonding Service
Purity
99.95%
Composition
-
Size
15 inch -16 inch dia.
Quantity Available
pcs
Catalog Number
5091
info
Sputtering
Indium bonding is utilized to attach CuCr sputtering targets to copper backing plates, ensuring efficient thermal and electrical conductivity during the physical vapor deposition process.
warning
HazMat Classification
Not classified as hazardous material.
description
Documentation
Safety Data Sheet (SDS) and Certificate of Analysis (COA) available for download. GHS-compliant labeling provided with all shipments.
local_shipping
Shipping
Shipped via FedEx Ground or UPS. Hazmat surcharges apply. International orders may require export compliance review. Custom packaging available.
verified
Quality Assurance
All products supplied with lot-specific COA including ICP-OES elemental analysis, XRD phase identification, and particle size distribution data.
description
Certificates of Analysis (COA)
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