Bonding service
Bonding ServiceChemical Name
Chemical Formula
Purity
99.998%
Composition
Size
104 mm dia.
EINECS Number
Quantity Available
pcs
CAS Number
Status
Product ID
BSOFHCCUIN1044N8
Hazmat
Catalog Number
9327
Description
M2 Backing Plate
Comments
OFHC
Indium bonding is used to attach sputtering targets to OFHC copper backing plates to ensure efficient thermal transfer and mechanical stability during the physical vapor deposition process.
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