Bonding service
Bonding ServiceBonding service, Bonding Service, 99.998%, 7 inch -8.99 inch dia.
Tags: Specialty-Inorganics
Product Specifications
Chemical Name
Chemical Formula
Purity
99.998%
Composition
Size
7 inch -8.99 inch dia.
EINECS Number
Quantity Available
pcs
CAS Number
Status
Product ID
BSOFHCCUIN784N8
Hazmat
Catalog Number
5079
Description
Backing plate, bonded to substrate.
Comments
OFHC
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Element Name
Bonding service
Symbol
OFHC Cu plate + Indium bonding
Atomic Number
-
Atomic Weight
-
Melting Point
156.6 °C (Indium layer)
Boiling Point
-
Density
-
Crystal Structure
-
Color / Appearance
Metallic copper plate with a silvery-white indium interface
Thermal Conductivity
390-400 W/m·K (Copper base)
Electrical Resistivity
-
Coefficient of Thermal Expansion
-
Electronegativity
-
Neutron Cross Section
-
Electron Configuration
-
This Product
BSOFHCCUIN784N8
Form
Bonding Service
Purity
99.998%
Composition
-
Size
7 inch -8.99 inch dia.
Quantity Available
pcs
Catalog Number
5079
info
Sputtering
Indium bonding is used to attach sputtering targets to OFHC copper backing plates to ensure efficient thermal transfer and mechanical stability during the physical vapor deposition process.
warning
HazMat Classification
Not classified as hazardous material.
description
Documentation
Safety Data Sheet (SDS) and Certificate of Analysis (COA) available for download. GHS-compliant labeling provided with all shipments.
local_shipping
Shipping
Shipped via FedEx Ground or UPS. Hazmat surcharges apply. International orders may require export compliance review. Custom packaging available.
verified
Quality Assurance
All products supplied with lot-specific COA including ICP-OES elemental analysis, XRD phase identification, and particle size distribution data.
description
Certificates of Analysis (COA)
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