Titanium + Indium Bonding, Bonding Service, 99.99%, 300 mm x 250 mm x 6 mm

Indium is used as a bonding material to attach titanium sputtering targets to copper backing plates, ensuring efficient thermal and electrical conductivity during the deposition process.

Titanium and indium bonding techniques are utilized to secure evaporation starter sources to hearths or crucibles to maintain thermal contact in high-vacuum systems.