Bonding service
Bonding ServiceChemical Name
Chemical Formula
Purity
99.995%
Composition
Size
2 inch -2.99 inch dia.
EINECS Number
Quantity Available
pcs
CAS Number
Status
Product ID
BSUSMACK224N5
Hazmat
Catalog Number
5067
Description
Backing plate with keeper, bonded to substrate.
Comments
Indium, elastomer, nano bonding
Bonding services utilize metallic or elastomer agents to secure sputtering targets to backing plates, ensuring efficient thermal transfer and mechanical stability during the physical vapor deposition process.
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