Chemical Name
Tungsten - Titanium
Chemical Formula
W/Ti
Purity
99.95%
Composition
90:10 wt%
Size
Delta 200
EINECS Number
Quantity Available
pcs
CAS Number
58397-70-9
Status
Product ID
DTWTI200003N5
Hazmat
Sputtering target: HazMat: UN3288 Granules: HazMat: UN3288 Powder: HazMat: UN3288
Catalog Number
5382
Description
(PE Bond on)
Comments
Bond On
Tungsten-Titanium alloy targets are used in magnetron sputtering to deposit thin-film diffusion barriers and adhesion layers in semiconductor metallization.
W-Ti serves as a critical barrier layer between silicon and aluminum or gold interconnects to prevent interdiffusion and electromigration.
Used in the production of specialized optical thin films where high-density, heat-resistant metallic layers are required.
Loading COA files…