Gold Indium Alloy, Foil, 99.99%, 20 x 20 -2 mm

Gold Indium alloy targets are used in sputtering processes to create thin films for specialized ohmic contacts and bonding layers in microelectronic devices.

Used as a low-temperature solder and contact material in semiconductor packaging, particularly for GaAs and InP based optoelectronic devices.

Utilized as a source material in physical vapor deposition to deposit precise Au-In alloy layers for flip-chip bonding and hermetic sealing.