Copper Silicide, Granules, 99.99%, 1 mm -6 mm

Copper silicide is utilized as a sputtering target material for the deposition of thin films in microelectronics to act as diffusion barriers or to improve adhesion between copper interconnects and silicon substrates.

Used in the semiconductor industry for the formation of ohmic contacts and as a passivation layer to prevent the migration of copper atoms into silicon wafers.