Copper Chromium Silicon Titanium Alloy, Granules, 99.99%, 1 mm -20 mm

CuCrSiTi alloy is utilized as a sputtering target material to deposit thin films that require high thermal stability, adhesion, and specific electrical properties in microelectronic and decorative coating applications.

This complex alloy is used in the development of high-strength, high-conductivity copper-based materials where chromium, silicon, and titanium act as precipitation hardening and grain refining agents.

Used in the fabrication of diffusion barriers and interconnect layers where the addition of Si and Ti improves the thermal stability and interface adhesion of copper-based metallization.