Chemical Name
Tin Silver
Chemical Formula
SnAg
Purity
99.99%
Composition
96.5:3.5 wt%
Size
3 mm -6 mm
EINECS Number
Quantity Available
kg
CAS Number
Status
Product ID
GRSNAG360004N
Hazmat
Catalog Number
5116
Description
Comments
Tin Silver alloys are used as sputtering targets to create thin-film coatings for lead-free solder bumps and interconnects in microelectronic packaging.
Used as a primary lead-free solder alloy (SAC or Sn-Ag binary) to provide mechanical strength and thermal fatigue resistance in electronic assemblies.
Utilized in physical vapor deposition processes to deposit conductive layers and bonding interfaces for semiconductor device fabrication.
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