Aluminum Germanium Alloy, Lump, 99.99%, 3 -25 mm approx

Aluminum Germanium alloy targets are used in physical vapor deposition to create thin films for semiconductor ohmic contacts and infrared coatings.

Used as a low-temperature brazing alloy and for forming eutectic bonds in microelectromechanical systems (MEMS) and integrated circuit packaging.

Utilized as a source material in vacuum evaporation processes to deposit conductive layers with specific thermal and electrical properties.