Aluminum Silicon Copper Alloy, Powder, 99.99%, -300 mesh (37.6 mic aps)

Aluminum Silicon Copper targets are used in physical vapor deposition to create conductive interconnects and thin-film metallization layers in integrated circuits, where silicon prevents spikes and copper improves electromigration resistance.

Used as a primary metallization material for CMOS devices and microchips to provide reliable electrical pathways between semiconductor components.

Utilized as a specialized casting and structural alloy where the addition of silicon improves fluidity and copper enhances mechanical strength and heat treatability.