Copper Silicide, Powder, 99.9%, -100 micron approx

Copper silicide is utilized as a sputtering target material for the deposition of thin films in microelectronics to act as a diffusion barrier or to improve adhesion between copper interconnects and silicon substrates.

Used in the semiconductor industry for the formation of ohmic contacts and as an intermediate phase in the passivation of silicon surfaces during copper metallization processes.

Investigated as a high-capacity anode material or conductive additive in lithium-ion batteries due to its ability to accommodate lithium insertion while maintaining structural integrity compared to pure silicon.