Copper Aluminum, Powder, 99.9%, -325 mesh

Copper-aluminum intermetallic targets are used in physical vapor deposition to create thin films for microelectronic interconnects and wear-resistant coatings.

Used as a master alloy or hardening phase (theta phase) in the production of high-strength aluminum alloys, particularly in the 2000 series.

Utilized as a source material in vacuum evaporation processes to deposit specialized metallic alloy films.