Tantalum Aluminide, Powder, 99.95%, -325 mesh (40 mic aps)

Tantalum aluminide is used as a sputtering target material to deposit thin films that serve as diffusion barriers or oxidation-resistant coatings in microelectronic and high-temperature applications.

Used as an alloying additive or intermetallic phase to improve the high-temperature strength, oxidation resistance, and structural integrity of advanced aerospace alloys.

Utilized in the development of high-temperature structural components due to its high melting point and excellent resistance to oxidation at elevated temperatures.