Tantalum Nitride, Powder, 99.5%, -325 +625 mesh (21 mic aps)

Tantalum nitride is widely used as a diffusion barrier layer between copper interconnects and silicon substrates to prevent copper migration into the dielectric.

Tantalum nitride targets are used in physical vapor deposition (PVD) processes to create thin film resistors and hard coatings.

Due to its high melting point and chemical stability, it is utilized in high-temperature environments and as a wear-resistant coating.