Titanium Silicide, Powder, 99.5%, -270 mesh (24 mic aps) approx

Titanium silicide is widely used as a contact material and for interconnects in CMOS fabrication due to its low electrical resistivity and high thermal stability.

Used as a sputtering target material to deposit thin films for microelectronic circuits and protective coatings.

Utilized for its high melting point and oxidation resistance in high-temperature structural applications and coatings.