Chemical Name
Tin Silver Copper Alloy
Chemical Formula
SnAgCu
Purity
99.999%
Composition
96.5:3:0.5 wt%
Size
3 mm approx.
EINECS Number
Quantity Available
kg
CAS Number
Status
Product ID
SHSNAGCU3005N
Hazmat
Powder: Class 4.1, UN3089, PG III
Catalog Number
7560
Description
Comments
Tin Silver Copper (SAC) alloy targets are used in physical vapor deposition to create lead-free conductive thin films and solderable layers in microelectronic packaging.
SAC alloys serve as the primary lead-free solder material for ball grid arrays (BGA) and flip-chip interconnects in semiconductor device assembly.
Atomized SAC alloy powders are utilized in specialized additive manufacturing processes for printing complex conductive geometries and electronic components.
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