Tin Silver Copper Alloy, Shots, 99.999%, 3 mm approx.

Tin Silver Copper (SAC) alloy targets are used in physical vapor deposition to create lead-free conductive thin films and solderable layers in microelectronic packaging.

SAC alloys serve as the primary lead-free solder material for ball grid arrays (BGA) and flip-chip interconnects in semiconductor device assembly.

Atomized SAC alloy powders are utilized in specialized additive manufacturing processes for printing complex conductive geometries and electronic components.