Aluminum Silicon Copper Alloy, Sputtering Target, 99.99%, 2 inch dia x 0.25 inch th.

Aluminum Silicon Copper targets are used in physical vapor deposition to create conductive interconnects and thin-film metallization layers in integrated circuits, where silicon prevents spikes and copper improves electromigration resistance.

Used as a primary metallization material for CMOS devices and microchips to provide reliable electrical pathways between semiconductor components.

Utilized as a specialized casting and structural alloy where the addition of silicon improves fluidity and copper enhances mechanical strength and heat treatability.