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Gold Boride

Sputtering Target

Tags: Precious-metal Boride Refractory Material Specialty Inorganics Alloys Sputtering

Product Specifications

Chemical Name

Gold Boride

Chemical Formula

AuB

Purity

99.99%

Composition

Size

3 inch dia x 0.125 inch th.

EINECS Number

Quantity Available

pcs

CAS Number

General SpecificationsApplicationsSafety and ShippingCertificates of Analysis (COA)

Element Name

Gold Boride

Symbol

AuB

Atomic Number

Atomic Weight

207.77 g/mol

Melting Point

Boiling Point

Density

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Sputtering

Gold boride can be utilized as a specialized sputtering target material for the deposition of thin films where both the high conductivity of gold and the hardness or chemical properties of boron are required.

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Semiconductors

Used in research for developing ohmic contacts and diffusion barriers in semiconductor device fabrication.

warning

HazMat Classification

Not hazardous for transportation

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Documentation

Safety Data Sheet (SDS) and Certificate of Analysis (COA) available for download. GHS-compliant labeling provided with all shipments.

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Shipping

Shipped via FedEx Ground or UPS. Hazmat surcharges apply. International orders may require export compliance review. Custom packaging available.

verified

Quality Assurance

All products supplied with lot-specific COA including ICP-OES elemental analysis, XRD phase identification, and particle size distribution data.

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Certificates of Analysis (COA)

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Gold Boride

Product Specifications

Sputtering

Semiconductors

HazMat Classification

Documentation

Shipping

Quality Assurance

Certificates of Analysis (COA)

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