Gold Tin Alloy

Gold-tin alloy targets are used in sputtering processes to deposit thin-film solder layers for fluxless bonding in microelectronic and optoelectronic packaging.

AuSn is a critical eutectic solder used for die-attachment of laser diodes and high-power LEDs due to its high thermal conductivity and creep resistance.

Used in semiconductor packaging for hermetic sealing and wafer-level bonding where a reliable, high-strength, and lead-free thermal interface is required.

AuSn pellets or wire are used as evaporation sources to create precise alloy thin films for ohmic contacts and flip-chip assemblies.