Boron, Sputtering Target, 99.97%, 25 mm dia x 3 mm th.

Boron is used as a critical p-type dopant in silicon-based semiconductor manufacturing to modify electrical conductivity.

Used as an alloying agent in steel and other metals to increase hardenability and improve mechanical properties at high temperatures.

High-purity boron targets are utilized in physical vapor deposition processes to create thin films for microelectronics and hard coatings.

Elemental boron and its compounds like boron carbide are used in the production of extremely hard, heat-resistant refractory materials.