Boron Copper, Sputtering Target, 99.97%, 10 mm x 10 mm x 1 mm th.

Boron copper alloys are utilized as sputtering target materials to deposit thin films for microelectronic and semiconductor applications where specific electrical and diffusion barrier properties are required.

Copper-boron master alloys are used in the metallurgical industry as deoxidizers and grain refiners to improve the mechanical properties and conductivity of copper-based alloys.