Copper(I) Phosphide, Sputtering Target, 99.9%, 3 inch dia x 0.125 inch th.

Used as a master alloy and deoxidizer in the production of phosphor bronze and other copper-based alloys to improve strength and corrosion resistance.

Utilized as a precursor material in the fabrication of sputtering targets for depositing copper phosphide thin films in electronic and photovoltaic research.

Investigated as a p-type semiconductor material for use in energy storage devices and specialized electronic components.