Copper Germanide, Sputtering Target, 99.99%, 2 inch dia x 0.125 inch th.

Copper Germanide is utilized as a sputtering target material for the deposition of thin films in the fabrication of advanced semiconductor interconnects and ohmic contacts.

Used in the development of low-resistivity metal-germanide phases for source/drain contacts and as a diffusion barrier in germanium-based microelectronic devices.