Copper Manganese, Sputtering Target, 99.9%, 2 inch dia x 3.1 mm th.

Copper Manganese alloys are used as sputtering targets to create thin-film seed layers in integrated circuits, where the manganese acts as a self-forming diffusion barrier.

Used as a master alloy to improve the mechanical properties, corrosion resistance, and vibration damping capacity of various copper-based and aluminum-based alloys.

Utilized in physical vapor deposition processes to deposit resistive or barrier films in microelectronic applications.