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Copper Manganese

Sputtering Target

Tags: Alloys 3D Printing

Product Specifications

Chemical Name

Copper Manganese

Chemical Formula

CuMn

Purity

99.9%

Composition

92/8 wt% Cu:Mn

Size

2 inch dia x 3.1 mm th.

EINECS Number

Quantity Available

pcs

CAS Number

Status

Product ID

SPCUMN2D3T03N

Hazmat

Catalog Number

12660

General SpecificationsApplicationsSafety and ShippingCertificates of Analysis (COA)

Element Name

Copper Manganese

Symbol

CuMn

Atomic Number

Atomic Weight

Melting Point

870 - 950 °C

Boiling Point

Density

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Crystal Structure

Face-centered cubic

Color / Appearance

Reddish-grey metallic

Thermal Conductivity

22 W/m·K

Electrical Resistivity

1.0 × 10⁻⁶ Ω·m

Coefficient of Thermal Expansion

18.0 µm/m·K

Neutron Cross Section

Electron Configuration

This Product

SPCUMN2D3T03N

Form

Sputtering Target

Composition

92/8 wt% Cu:Mn

Size

2 inch dia x 3.1 mm th.

Quantity Available

pcs

Catalog Number

12660

info

Sputtering

Copper Manganese alloys are used as sputtering targets to create thin-film seed layers in integrated circuits, where the manganese acts as a self-forming diffusion barrier.

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Alloying

Used as a master alloy to improve the mechanical properties, corrosion resistance, and vibration damping capacity of various copper-based and aluminum-based alloys.

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Evaporation materials

Utilized in physical vapor deposition processes to deposit resistive or barrier films in microelectronic applications.

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HazMat Classification

Not classified as hazardous material.

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Documentation

Safety Data Sheet (SDS) and Certificate of Analysis (COA) available for download. GHS-compliant labeling provided with all shipments.

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Shipping

Shipped via FedEx Ground or UPS. Hazmat surcharges apply. International orders may require export compliance review. Custom packaging available.

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Quality Assurance

All products supplied with lot-specific COA including ICP-OES elemental analysis, XRD phase identification, and particle size distribution data.

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Certificates of Analysis (COA)

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