Copper Titanium, Sputtering Target, 99.99%, 2 inch dia x 0.125 inch th.

Copper Titanium targets are used in physical vapor deposition to create thin films for microelectronics and decorative coatings where high hardness and corrosion resistance are required.

Used as a master alloy in the production of high-strength copper-titanium alloys, which serve as age-hardenable alternatives to beryllium-copper in electrical connectors and springs.

Utilized as a source material in vacuum evaporation processes to deposit specialized metallic layers for electronic components.