Copper Titanium, Sputtering Target, 99.99%, 3 inch dia x 0.25 inch th.

Copper Titanium targets are used in physical vapor deposition to create thin films for microelectronics and decorative coatings where high hardness and corrosion resistance are required.

Used as a master alloy in the production of high-strength copper-titanium alloys, which serve as age-hardenable alternatives to beryllium-copper in electrical connectors and springs.

Utilized as a source material in vacuum evaporation processes to deposit specialized metallic layers for electronic components.