Dimolybdenum Nitride, Sputtering Target, 99.9%, 3 inch dia x 0.125 inch th.

Dimolybdenum nitride is utilized as a sputtering target material to deposit hard, wear-resistant thin films and diffusion barriers in microelectronic and industrial coating applications.

Used in semiconductor manufacturing as a stable diffusion barrier layer to prevent copper migration and as a gate electrode material due to its high thermal stability and metallic conductivity.