Molybdenum Copper

Molybdenum Copper alloy targets are used in physical vapor deposition to create thin films for heat sinks and conductive layers in microelectronics.

Used as a heat sink material and base plate for high-power semiconductor devices due to its tailorable thermal expansion and high thermal conductivity.

Applied as a thermal management substrate for laser diodes and LEDs to ensure stable performance and longevity of optical components.

Utilized in high-temperature vacuum furnace components and aerospace applications where thermal stability and heat dissipation are critical.