Molybdenum Copper Silicon, Sputtering Target, 99.95%, 3 inch dia x 0.25 inch th.

Molybdenum copper silicon alloys are utilized as sputtering target materials to deposit thin films that require a specific balance of thermal stability, electrical conductivity, and adhesion in microelectronic applications.

Used in the fabrication of diffusion barriers and contact layers where the combination of molybdenum's refractory nature, copper's conductivity, and silicon's compatibility with substrate materials is required.