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Nickel Nitride

Sputtering Target

Tags: Nitride Refractory Material Specialty Inorganics Sputtering

Product Specifications

Chemical Name

Nickel Nitride

Chemical Formula

NiN

Purity

99.5%

Composition

Size

2 inch dia x 0.125 inch th.

EINECS Number

Quantity Available

pcs

CAS Number

Status

Product ID

SPNIN2D3T02N5

Hazmat

Powder: HazMat: UN3077

General SpecificationsApplicationsSafety and ShippingCertificates of Analysis (COA)

Element Name

Nickel Nitride

Symbol

NiN

Atomic Number

Atomic Weight

Melting Point

Boiling Point

Density

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Crystal Structure

Hexagonal

Color / Appearance

Black powder

Thermal Conductivity

Electrical Resistivity

Coefficient of Thermal Expansion

Neutron Cross Section

Electron Configuration

This Product

SPNIN2D3T02N5

Form

Sputtering Target

Size

2 inch dia x 0.125 inch th.

Quantity Available

pcs

info

Sputtering

Nickel nitride is utilized as a target material in reactive sputtering processes to deposit thin films for magnetic recording media and protective coatings.

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Semiconductors

Used in the fabrication of semiconductor devices as a diffusion barrier layer and in the development of ohmic contacts.

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HazMat Classification

Powder: HazMat: UN3077

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Documentation

Safety Data Sheet (SDS) and Certificate of Analysis (COA) available for download. GHS-compliant labeling provided with all shipments.

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Shipping

Shipped via FedEx Ground or UPS. Hazmat surcharges apply. International orders may require export compliance review. Custom packaging available.

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Quality Assurance

All products supplied with lot-specific COA including ICP-OES elemental analysis, XRD phase identification, and particle size distribution data.

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Certificates of Analysis (COA)

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Nickel Nitride

Product Specifications

Sputtering

Semiconductors

HazMat Classification

Documentation

Shipping

Quality Assurance

Certificates of Analysis (COA)

Don’t see the Right Version?

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