Nickel Platinum Alloy ), Sputtering Target, 99.95%, 3 inch dia x 0.125 inch th.

Nickel Platinum alloy targets are used in magnetron sputtering to deposit thin films for the formation of nickel-platinum silicide contacts in semiconductor device fabrication.

Used in the silicidation process to improve the thermal stability of nickel silicide contacts in advanced CMOS nodes.

The addition of platinum to nickel enhances the corrosion resistance and high-temperature stability of the resulting alloy system.