Chemical Name
Lead
Chemical Formula
Pb
Purity
99.99%
Composition
Size
2 inch dia x 0.125 inch th.
EINECS Number
Quantity Available
pcs
CAS Number
7439-92-1
Status
Product ID
SPPB2D3T0004N-1
Hazmat
Powder: 9, UN3077, PG III
Catalog Number
2675
Description
Comments
RD~99%
Lead sputtering targets are used to deposit thin films for superconducting applications, radiation shielding layers, and as a component in ferroelectric thin-film deposition.
High-purity lead is used as an evaporation material in physical vapor deposition processes to create protective coatings and specific electronic components.
Lead is widely used as an alloying element to improve the machinability of steels and copper alloys, and is a primary component in various solder and bearing metal alloys.
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