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Palladium Silicon Alloy

Sputtering Target

Tags: Precious-metal Sputtering

Product Specifications

Chemical Name

Chemical Formula

Pd/Si

Purity

99.95%

Composition

70:30 wt%

Size

3 inch dia x 0.125 inch th.

EINECS Number

Quantity Available

pcs

CAS Number

Status

Product ID

SPPDSI3D3T3N5

Hazmat

Catalog Number

6250

Description

Comments

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General SpecificationsApplicationsSafety and ShippingCertificates of Analysis (COA)

Element Name

Palladium Silicon Alloy

Symbol

Pd/Si

Atomic Number

Atomic Weight

Melting Point

Boiling Point

Density

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Sputtering

Palladium silicon alloy targets are used in physical vapor deposition to create thin films for ohmic contacts and Schottky barriers in semiconductor devices.

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Semiconductors

Used in the formation of palladium silicide layers to provide stable, low-resistance electrical interfaces in integrated circuits.

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Evaporation materials

Utilized as a source material in electron-beam or thermal evaporation processes to deposit precise metallic-silicide thin films.

warning

HazMat Classification

Not classified as hazardous material.

description

Documentation

Safety Data Sheet (SDS) and Certificate of Analysis (COA) available for download. GHS-compliant labeling provided with all shipments.

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Shipping

Shipped via FedEx Ground or UPS. Hazmat surcharges apply. International orders may require export compliance review. Custom packaging available.

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Quality Assurance

All products supplied with lot-specific COA including ICP-OES elemental analysis, XRD phase identification, and particle size distribution data.

Palladium Silicon Alloy

Product Specifications

Sputtering

Semiconductors

Evaporation materials

HazMat Classification

Documentation

Shipping

Quality Assurance

Certificates of Analysis (COA)

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