SAC305, Sputtering Target, 99.99%, 12 inch dia x 0.125 inch th.

SAC305 alloy is utilized as a sputtering target material to deposit lead-free solder thin films for advanced electronic packaging and interconnect applications.

As a lead-free solder alloy composed of 96.5% tin, 3.0% silver, and 0.5% copper, it serves as a primary alloying standard for reliable surface mount technology (SMT) assemblies.

Used extensively in semiconductor packaging for ball grid array (BGA) spheres and flip-chip interconnects to provide electrical and mechanical connectivity.