Chemical Name
Tin Copper
Chemical Formula
SnCu
Purity
99.99%
Composition
63:35 at%
Size
2 inch dia x 0.250 inch th.
EINECS Number
Quantity Available
pcs
CAS Number
Status
Product ID
SPSNCU2D6T04N
Hazmat
Catalog Number
5023
Description
Comments
Tin-copper alloy targets are used in physical vapor deposition to create conductive thin films and solderable coatings in microelectronic assemblies.
Used as a primary constituent in lead-free solder alloys and bronze formulations to improve mechanical strength and corrosion resistance.
Utilized in powder bed fusion and directed energy deposition processes for creating complex bronze-based components and functional prototypes.
Applied via flame or plasma spray to provide wear-resistant and anti-frictional metallic coatings on industrial machinery parts.
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