Tin Copper, Sputtering Target, 99.99%, 2 inch dia x 0.250 inch th.

Tin-copper alloy targets are used in physical vapor deposition to create conductive thin films and solderable coatings in microelectronic assemblies.

Used as a primary constituent in lead-free solder alloys and bronze formulations to improve mechanical strength and corrosion resistance.

Utilized in powder bed fusion and directed energy deposition processes for creating complex bronze-based components and functional prototypes.

Applied via flame or plasma spray to provide wear-resistant and anti-frictional metallic coatings on industrial machinery parts.