Tantalum silicon, Sputtering Target, 99.95%, 12.982 inch dia x 0.35 inch th.

Tantalum-silicon composite targets are used in magnetron sputtering to deposit thin films for diffusion barriers and gate electrodes in integrated circuit fabrication.

Used in the semiconductor industry to create tantalum silicide (TaSi2) layers which serve as low-resistivity interconnects and ohmic contacts.

Tantalum-silicon mixtures are utilized as source materials in physical vapor deposition processes to create protective and functional silicide coatings.