Titanium Silicide, Sputtering Target, 99.95%, 1 inch dia x 0.125 inch th.

Titanium silicide is widely used as a contact material and for interconnects in CMOS fabrication due to its low electrical resistivity and high thermal stability.

Used as a sputtering target material to deposit thin films for microelectronic circuits and protective coatings.

Utilized for its high melting point and oxidation resistance in high-temperature structural applications and coatings.