Tungsten Boride, Sputtering Target, 99.5%, 4 inch dia x 0.25 inch th.

Tungsten boride is utilized as a sputtering target material to create hard, wear-resistant thin films and diffusion barriers in microelectronic and industrial coating processes.

Due to its high melting point and extreme hardness, W2B is employed in the production of refractory components that must withstand severe thermal and mechanical stress.

Used in thermal spray processes to provide protective coatings on surfaces requiring high resistance to abrasion, erosion, and high-temperature oxidation.