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Tungsten Silicide

Sputtering Target

Tags: Sputtering

Product Specifications

Chemical Name

Tungsten Silicide

Chemical Formula

W3Si5

Purity

99.5%

Composition

Size

2 inch dia x 0.125 inch th.

EINECS Number

Quantity Available

pcs

CAS Number

186089-94-1

Status

Product ID

SPW3SI52D3T2N5

Hazmat

Powder: HazMat: UN3178

Catalog Number

5597

Description

Comments

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General SpecificationsApplicationsSafety and ShippingCertificates of Analysis (COA)

Element Name

Tungsten Silicide

Symbol

W3Si5

Atomic Number

Atomic Weight

692.00 g/mol

Melting Point

2320 °C

Boiling Point

Density

Crystal Structure

Hexagonal

Color / Appearance

Gray metallic powder

Thermal Conductivity

Electrical Resistivity

Coefficient of Thermal Expansion

Neutron Cross Section

Electron Configuration

This Product

SPW3SI52D3T2N5

Form

Sputtering Target

Size

2 inch dia x 0.125 inch th.

Quantity Available

pcs

info

Sputtering

Tungsten silicide is used as a sputtering target material to create thin films for ohmic contacts and interconnects in microelectronic devices.

info

Semiconductors

Used in the fabrication of integrated circuits as a low-resistivity gate material and for Schottky barrier formation.

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HazMat Classification

Powder: HazMat: UN3178

description

Documentation

Safety Data Sheet (SDS) and Certificate of Analysis (COA) available for download. GHS-compliant labeling provided with all shipments.

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Shipping

Shipped via FedEx Ground or UPS. Hazmat surcharges apply. International orders may require export compliance review. Custom packaging available.

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Quality Assurance

All products supplied with lot-specific COA including ICP-OES elemental analysis, XRD phase identification, and particle size distribution data.

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Certificates of Analysis (COA)

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Tungsten Silicide

Product Specifications

Sputtering

Semiconductors

HazMat Classification

Documentation

Shipping

Quality Assurance

Certificates of Analysis (COA)

Don’t see the Right Version?

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