Tungsten Silicide, Sputtering Target, 99.5%, 4 inch dia x 0.25 inch th.

Tungsten silicide is used as a sputtering target material to create thin films for ohmic contacts and interconnects in microelectronic devices.

Used in the fabrication of integrated circuits as a low-resistivity gate material and for polycide structures to improve device performance.

Utilized for its high melting point and chemical stability in high-temperature environments and protective coatings.