Tungsten - Titanium, Sputtering Target, 99.99%, 125 mm dia x 10 mm th.

Tungsten-Titanium alloy targets are used in magnetron sputtering to deposit thin-film diffusion barriers and adhesion layers in semiconductor metallization.

W-Ti serves as a critical barrier layer between silicon and aluminum or gold interconnects to prevent interdiffusion and electromigration.

Used in the production of specialized optical thin films where high-density, heat-resistant metallic layers are required.