Tin Lead Alloy, Wire W, 99.5%, 0.15 mm dia. x Continuous

Tin-lead alloy targets are utilized in physical vapor deposition processes to create thin films for electronic components and specialized solderable coatings.

Tin and lead are combined in various ratios to create solders and fusible alloys with specific melting points and mechanical properties for industrial joining.

Used in semiconductor packaging and assembly for flip-chip bumping and die attachment to provide electrical connectivity and mechanical support.